ELECTRICAL ENGINEERING STUDENT · EMBEDDED HARDWARE · INDUSTRIAL DESIGN

Industrial Design & Embedded Development.

OPERATOR // TIAM BENNETT

01 // SYSTEM OVERVIEW & BACKGROUND

I am an Electrical Engineering student at the University of Ottawa with a degree background in Industrial Design, seeking roles in hardware design and hardware verification. I build and prototype complete embedded hardware systems, bridging multi-layer PCB layout, component selection, board bring-up, and mechanical enclosure integration (DFM/CAD) into functional physical assemblies.

My work centers on benchtop execution, including hands-on lab debugging, signal verification, and C/C++ microcontroller firmware. Driven by an interest in computer architecture, I am also learning digital logic design and building a custom RISC-V processor project in Verilog on FPGAs.

01.1 // HARDWARE & TOOLCHAIN

Design & Verification Stack

  • PCB & Hardware Design Multi-layer board layout, schematic capture, component selection, DFM/DFA, power distribution, and signal routing using KiCad and Altium.
  • Lab & Board Bring-Up Oscilloscopes, logic analyzers, DMMs, SMD soldering/rework, signal verification, and hardware protocols (SPI, I2C, UART, USB).
  • Digital Logic & Firmware Verilog HDL, FPGA toolchains (Yosys, Vivado, Verilator), and C/C++ firmware development for microcontrollers (STM32, ESP32, ARM Cortex-M).
01.2 // BACKGROUND & FOCUS

Education & Project Scope

  • Education & Foundation

    B.A.Sc. Candidate in Electrical Engineering at the University of Ottawa, backed by a formal background and degree in Industrial Design.

  • Core Hardware Scope

    Full-lifecycle embedded boards, spanning schematic capture, component selection, board bring-up, and custom enclosure fit.

  • Digital Architecture & RISC-V

    Actively learning digital logic design and developing a custom RISC-V core project in Verilog for FPGA target hardware.

03 // WORK EXPERIENCE & CHRONOLOGY

Project Manager

University of Ottawa – Ottawa, ON Sept 2025 – June 2026
  • Technical Mentorship: Mentored 40+ students across two engineering labs in embedded programming (Arduino), hardware testing, and CAD modeling to elevate fabrication quality.
  • Hardware Evaluation: Conducted weekly evaluations of student software and hardware concepts to ensure functional execution, testability, and lab safety.

Lead Computer Service Technician

Staples – Cranbrook, BC Feb 2023 – July 2024
  • Hardware Repair & Diagnostics: Performed hands-on component troubleshooting, system diagnostics, hardware upgrades, and repairs on consumer desktop and laptop systems.
  • Technical Communication: Translated complex hardware issues and repair options into clear, actionable advice for non-technical clients.

Product Lead & Co-Founder

Phase Studio – Toronto, ON Jan 2019 – July 2022
  • Hardware & Firmware QA: Debugged firmware and board-level defects using C, KiCad, and SolidWorks across 400+ deployed units.
  • Overseas DFM & Manufacturing: Managed end-to-end hardware development and manufacturing (DFM/DFA) in China, establishing PCB quality testing standards to drive $225k+ in single-month revenue.

Technical Communicator

APMA – Toronto, ON Apr 2022 – July 2022
  • 3D CAD & Visualization: Modeled high-fidelity 3D assets in SolidWorks and Fusion 360 to accelerate technical visualization for CES 2023 product demos.
  • Engineering Coordination: Bridge technical specifications between international engineering teams and executive leadership to hit tight exhibition deadlines.

Design Researcher

Humber College – Toronto, ON Nov 2021 – May 2022
  • DFM & Prototyping: Evaluated manufacturing feasibility and mechanical integrity for physical concepts using 3D CAD modeling and rapid functional prototypes.
  • Cross-Faculty Leadership: Coordinated project deliverables by leading technical design workshops and physical prototyping workflows.

04 // TECHNICAL SKILLS & LAB TOOLS

Embedded & Circuit Design

  • Microcontrollers & MCUs: ESP32, ATmega32U4, STM32, ARM Cortex-M
  • Digital Logic & FPGA: Verilog, RTL synthesis, Mano architecture, custom RISC-V design [LEARNING FOCUS]
  • Hardware Protocols: SPI, I2C, UART, CAN, USB
  • Sensors & Peripherals: IMUs (GY-521), Time-of-Flight (VL53L1X), ADCs (HX711), Encoders
  • Power & Actuators: Li-ion BMS, battery pack spot-welding, stepper drivers (TMC2209), BLDC theory

Software & Developer Tools

  • Embedded Languages: Embedded C, C++
  • Scripting & Data: Python (scripts, data plotting, automation), MATLAB
  • RTL & Simulation: Verilog, ModelSim / Vivado basics
  • Developer Workflow: Git, GitHub, Linux CLI, Bash

Mechanical Design & DFM

  • 3D CAD Software: Onshape (primary), Fusion 360, SolidWorks
  • Design for Excellence (DFX): DFM, DFA, tolerance stack-up analysis, fitment design
  • Prototyping & Fabrication: FDM 3D printing (slicing & tuning), Laser cutting, CNC routing
  • Visualization & Rendering: KeyShot, Blender Cycles
  • Mechanical Systems: Cycloidal drives, custom mechanisms, linkages

Hardware Lab & Prototyping

  • PCB & Soldering: Through-hole, SMD soldering, harness assembly
  • Lab Equipment: Digital Oscilloscope, Multimeter, DC Bench Power Supply, Logic Analyzer
  • Hardware Debugging: Signal tracing, circuit troubleshooting, power rail verification
  • Fabrication: Battery pack spot welding, rapid enclosure integration
  • Technical Documentation: Schematic entry, Bill of Materials (BOM), technical specs

05 // TRANSMIT MESSAGE / CONTACT

I'm currently open to embedded hardware, firmware, and PCB design opportunities. Whether you have an engineering role to discuss or a project in mind, let's talk.

LOCATION: OTTAWA, ON, CANADA // TIMEZONE: UTC-4

Prefer direct email? Reach out at tiambennett@gmail.com